基本信息
浏览量:0
职业迁徙
个人简介
Sherman Shan Chen (Member, IEEE) received the M.S.E.E. degree in electronics and communication from Zhejiang University, Hangzhou, China, in 2009.
He was an SI/PI Engineer/Manager with DELL- EMC, Newton, MA, USA, Intel, Santa Clara, CA, USA, Cisco, San Jose, CA, USA, and Kandou Bus, Lausanne, Switzerland. He has years of experiences with high-speed system/package and chip-level design. His current research interests include next generation high-speed bus encoding, SI-PI cosimulation, and advanced packaging techniques.
研究兴趣
论文共 13 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.275-279, (2023)
引用0浏览0EIWOS引用
0
0
IEEE Transactions on Signal and Power Integrity (2023): 53-63
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON)pp.11-12, (2023)
2023 IEEE 7th Global Electromagnetic Compatibility Conference (GEMCCON)pp.10-10, (2023)
2022 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI)pp.402-408, (2022)
IEEE Transactions on Signal and Power Integrity (2022): 65-73
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2022)
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.630-633, (2022)
引用0浏览0EIWOS引用
0
0
2022 Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC)pp.97-100, (2022)
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI)pp.1-4, (2021)
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn