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个人简介
Prof Lee has been focusing his research on the development of packaging and assembly technologies for electronics and optoelectronics. The topics of his R&D interests include wafer level packaging and 3D IC integration, additive manufacturing, LED packaging for solid-state lighting, lead-free soldering and reliability analysis. The research outcomes of Prof Lee’s group have been documented in numerous technical papers in international journals and conference proceedings. He also co-authored 4 books and 9 book chapters. Due to his technical contributions, Prof Lee received many honors and awards over the years. In addition to being the recipient of 13 best/outstanding paper awards and 6 major professional society awards, Prof Lee is Fellow of IEEE, ASME, IMAPS, and Institute of Physics (UK). He is also Editor-in-Chief of ASME Journal of Electronic Packaging.
研究兴趣
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2022 19th China International Forum on Solid State Lighting & 2022 8th International Forum on Wide Bandgap Semiconductors (SSLCHINA: IFWS)pp.228-230, (2023)
IEEE Electron Device Lettersno. 3 (2023): 504-507
International journal of molecular sciencesno. 18 (2023): 14350-14350
2023 International Conference on Electronics Packaging (ICEP)pp.135-136, (2023)
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2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-4
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2022)
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2022)
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)pp.241-242, (2022)
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