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个人简介
Seongguk Kim (Graduate Student Member, IEEE) received the B.S. degree in electrical engineering from Korea University, Seoul, South Korea, in 2018, and the M.S. degree in electrical engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2020, where he is currently pursuing the Ph.D. degree.
His current research interests include signal and power integrity design and analysis in a processing-in-memory (PIM) system based on high-bandwidth memory (HBM).
研究兴趣
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 6 (2023): 1674-1683
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Seongguk Kim,Keeyoung Son, Jiwon Yoon,Taein Shin,Keunwoo Kim,Boogyo Sim, Joonsang Park, Seonguk Cho,Jihun Kim,Haeyeon Kim,Joungho Kim,Hyunwook Park
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
Keeyoung Son, Joonsang Park,Seongguk Kim,Boogyo Sim,Keunwoo Kim,Seonguk Choi, Hyunsik Kim,Joungho Kim
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2023)
2023 IEEE 32ND CONFERENCE ON ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING AND SYSTEMS, EPEPSpp.1-3, (2023)
2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI)pp.125-130, (2023)
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