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个人简介
His current research topics are modeling and simulation of problems for microelectronics engineering.
One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework.
One of the founders of modern Technology Computer Aided Design (TCAD), Siegfried Selberherr has provided modeling and software development tools invaluable to the continued miniaturization of semiconductor devices. TCAD involves the use of computer simulation to develop and optimize semiconductor processing technologies. Selberherr developed MINIMOS for two-dimensional predictive simulation of the electrical characteristics of miniaturized devices to understand and control the short-channel effects and doping profiles encountered as device sizes shrink. MINIMOS was later enhanced for three-dimensional simulation to address energy transport and interface physics. He also created the ZOMBIE and PROMIS simulators, which incorporated mesh generation and programming interfaces. Selberherr then developed the Vienna Integrated System for TCAD Applications (VISTA) to combine both process and device simulation tools in a common framework.
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论文共 861 篇作者统计合作学者相似作者
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PHYSICA B-CONDENSED MATTER (2024): 415362-415362
PHYSICA B-CONDENSED MATTER (2024): 415612
Solid-State Electronics (2023): 108491-108491
Micromachinesno. 5 (2023): 898-898
2023 IEEE LATIN AMERICAN ELECTRON DEVICES CONFERENCE, LAEDCpp.1-4, (2023)
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2023 IEEE 15th International Conference on ASIC (ASICON)pp.1-4, (2023)
Mario Bendra,Simone Fiorentini,Johannes Ender,R. L. de Orio, T. Hadámek,Nils Petter Jørstad, B. Pruckner,Siegfried Selberherr,Wolfgang Goes,Viktor Sverdlov
MIPROpp.159-162, (2023)
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