基本信息
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职业迁徙
个人简介
RFIC module lead engineer responsible for technical chip, package, and PCB requirements (RFIC circuit block design and design methodology, radio architecture definition based on system requirements, power management, ESD, calibrations, interface definitions, RF test, burn-in qualification, customer demo and sampling).
Extensive millimeter-wave, RF, and analog design experience (LNA, PA, mixer, VCO, PLL, phase-shifter, envelope detector, pre-distortion, LDO, bandgap).
Ability to manage dynamic cross-disciplinary engineering operations and obtain buy-in from multiple stakeholders.
Experience assessing cost/schedule/performance trade-offs and making recommendations to marketing and/or customers.
Extensive millimeter-wave, RF, and analog design experience (LNA, PA, mixer, VCO, PLL, phase-shifter, envelope detector, pre-distortion, LDO, bandgap).
Ability to manage dynamic cross-disciplinary engineering operations and obtain buy-in from multiple stakeholders.
Experience assessing cost/schedule/performance trade-offs and making recommendations to marketing and/or customers.
研究兴趣
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