基本信息
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Bio
Sayan Seal received the B.Sc. degree in physics and the B.Tech. degree in radiophysics and electronics from the University of Calcutta, Kolkata, India, in 2008 and 2011, respectively, and the M.S. and Ph.D. degrees in electrical engineering from the University of Arkansas, Fayetteville, AR, USA, in 2013 and 2017, respectively. His dissertation was focused on developing 3-D packaging architectures for silicon carbide power devices.
During his M.S. degree, he was with the NSF GREEN Research Center for Nanoplasmonic Solar Cells, Fayetteville. During his Ph.D. degree, he was associated with the NSF Engineering Research Center named Power Optimization for Electro-Thermal Systems (POETS), Urbana, IL, USA. He was involved in high-performance packaging research for wide bandgap power modules. He is currently an Electronics Design Engineer with Cree, Inc., Fayetteville. His current research interest includes the design and fabrication of nanoscale reflectors for enhancing light trapping in thin-film solar cells.
Research Interests
Papers共 22 篇Author StatisticsCo-AuthorSimilar Experts
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2019 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP)pp.83-88, (2019)
PCIM Europe 2018 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-8, (2018)
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International Symposium on Microelectronicsno. 1 (2018): 000317-000325
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. HiTEC (2018): 000087-000092
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017 (2017)
2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP) (2017)
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Author Statistics
#Papers: 22
#Citation: 221
H-Index: 8
G-Index: 14
Sociability: 4
Diversity: 2
Activity: 0
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