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论文共 272 篇作者统计合作学者相似作者

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Comprehensive Time Dependent Dielectric Breakdown (TDDB) Characterization of Ferroelectric Capacitors Under Bipolar Stress Conditions
Priyankka Gundlapudi Ravikumar,Prasanna Venkatesan Ravindran,Khandker Akif Aabrar, Taeyoung Song,Sharadindu Gopal Kirtania, Dipjyoti Das,Chinsung Park,Nashrah Afroze,Mengkun Tian,Shimeng Yu, Ahmad Ehtesham Islam,Suman Datta,
2024 IEEE International Reliability Physics Symposium (IRPS)pp.1-5, (2024)
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Modeling of Post-Cycling Retention Bake in 3-D CTF TLC NAND Arrays
Rashmi Saikia, Himanshu Rai,Souvik Mahapatra
2024 IEEE International Reliability Physics Symposium (IRPS)pp.1-6, (2024)
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A Device to Circuit Reliability Framework for BTI and HCD Aging
Payel Chatterjee,Karan Singh Thakor,Souvik Mahapatra
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
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Impact of Gate Insulator Process on NBTI in FinFETs and Resulting Ring Oscillator Degradation Under Normal and Overclocking Usage Conditions
Arnav Shaurya Bisht,Payel Chatterjee,Souvik Mahapatra
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
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Study of Trap Generation in NAND Flash Tunnel Oxide using TCAD
Anuj Kumar,Ravi Tiwari, Mohit Bajaj, Denis Dolgos,Lee Smith,Souvik Mahapatra
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
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A TCAD Framework for HCD in n-MOSFETs for PMIC Applications
Himanshu Diwakar,Souvik Mahapatra
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM)pp.1-3, (2024)
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A Generic Trap Generation Framework for MOSFET Reliability-Part I: Gate Only Stress-BTI, SILC, and TDDB
Souvik Mahapatra, Aseer Ansari, Arnav Shaurya Bisht, Nilotpal Choudhury,Narendra Parihar, Payel Chatterjee,Prasad Gholve, Ravi Tiwari,Satyam Kumar,Tarun Samadder
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 114-125
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Tunneling Leakage Current Dependent RDD Model Framework for Gate Oxide TDDB
Tarun Samadder,Souvik Mahapatra
2023 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES, SISPADpp.193-196, (2023)
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