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Papers共 49 篇Author StatisticsCo-AuthorSimilar Experts

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3-Layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator with High Density TSV for Advanced CMOS Image Sensor Applications
Stephane Nicolas, Jerzy-Javier Suarez-Berru,Nicolas Bresson,Carole Socquet-Clerc,Myriam Assous,Stephan Borel,Remi Velard,Jerome Dechamp,Renan Bouis, Antonio Roman,Karine Abadie, Damien Hebras
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.305-311, (2024)
Cited0Views0EIWOSBibtex
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Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors
Stephan Borel,Myriam Assous,Remi Velard, Jerzy-Javier Suarez-Berru,Stephane Nicolas,Jerome Dechamp,Renan Bouis,Lionel Vignoud, Paul Valentin, Jeremy Marchand, Antonio Roman,Messaoud Bedjaoui
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.771-777, (2024)
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Backside Thinning Process Development for High-Density TSV in a 3-Layer Integration
Renan Bouis, Jeremy Marchand, Agathe Andre,Stephan Borel,Jerome Dechamp,Lionel Vignoud, Paul Valentin,Myriam Assous, Damien Hebras
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.370-377, (2024)
Cited0Views0EIWOSBibtex
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Recent Progress in the Development of High-Density TSV for 3-Layers CMOS Image Sensors
Stephan Borel,Myriam Assous,Stephane Moreau,Remi Velard
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1156-1163, (2023)
Cited7Views0EIWOSBibtex
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Demonstration of a Wafer Level Face-To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications
Jerzy Javier Suarez Berru,Stephane Nicolas,Nicolas Bresson,Myriam Assous,Stephan Borel
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.97-102, (2023)
Cited8Views0EIWOSBibtex
8
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Author Statistics

#Papers: 49

#Citation: 909

H-Index: 21

G-Index: 29

Sociability: 5

Diversity: 2

Activity: 0

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