Sebastien Thuries

Sébastien Thuries received the master’s degree from the University of Montpellier, Montpellier, France, in 2003. He joined CEA/Leti, Grenoble, France, in 2004, as a Research Engineer. He is leading the High-Density 3D Architecture and Design Group, CEA-LETI, including fine pitch 3D stacking as well as monolithic 3D (M3D). He has worked on and led several digital ASIC developments for a set of application, such as 4G digital baseband, complex imagers, system on chip, and mixed signal RF over the last decade. He has been a pioneer in FDSOI digital design and back biasing capability. He leads the research team on new architecture and design paradigm raised by M3D-IC in order to optimize the full system to technology fields.