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Rohit Sharma (Senior Member, IEEE) received the B.E. degree in electronics and telecommunication engineering from the North Maharashtra University, Jalgaon, India, in 2000, the M.Tech. degree in systems engineering from the Dayalbagh Educational Institutes, Dayalbagh, India, in 2003, and the Ph.D. degree in electronics and communication engineering from the Jaypee University of Information Technology, Waknaghat, India, in 2009.
He worked as a Postdoctoral Fellow with the Design Automation Lab, Seoul National University, Seoul, South Korea, from January 2010 to December 2010. He was a Postdoctoral Fellow with the Interconnect Focus Centre, Georgia Institute of Technology, Atlanta, GA, USA, from January 2011 to June 2012. He joined the Department of Electrical Engineering, Indian Institute of Technology Ropar (IIT Ropar), Rupnagar, India, in 2012, where he is currently an Associate Professor. All along his tenure with the IIT Ropar, he has initiated activities in the area of Electronic Packaging. His research interests include design of high-speed chip–chip and on-chip interconnects, graphene-based nanoelectronic devices and interconnects, signal and thermal integrity in high-speed interconnects, and 3-D ICs/packages and application of machine learning in advanced packaging and systems.
Dr. Sharma is an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology and a Program Committee member in IEEE ECTC, IEEE EPEPS, and IEEE EDAPS. He has been the General Co-Chair of the IEEE EDAPS, in 2018. He is the Co-Chair of the IEEE EPS Technical Committee on Electrical Design, Modeling, and Simulation. He is a Fellow of the Institution of Electronics and Telecommunication Engineers, India and the Institution of Engineering and Technology, U.K.
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论文共 68 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2023): 1533-1544
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.1429-1430, (2023)
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Memories - Materials, Devices, Circuits and Systems (2023): 100081-100081
Sunil Pathania,Suyash Kushwaha,Somesh Kumar,Mallikarjun Vasa, Ashish Shrivastava,Vijender Kumar,Bhyrav Mutnury,Rohit Sharma
2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMOpp.154-157, (2023)
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IEEE ACCESS (2023): 131191-131204
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.960-966, (2023)
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