For the last 25 years, I also developed novel methods for CMP polishing of metals and dielectrics used in advanced semiconductor manufacturing nodes. Some of the these advances include, abrasive-free polishing of copper, tunable polishing of dielectrics and use of porous particles for next generation CMP processes, and development of the layer by layer control digital CMP process. Currently at Entegris, I am assisting in chemical mechanical polishing slurries for SiC

I have published over 500 referred research papers (> 15,000 citations & H index of 56) filed for/awarded > 50 patents, and graduated over 50 PhD students. I have been elected a Fellow of seven prestigious international technical societies [Materials Research Society (MRS), American Society of Materials (ASM) , The Electrochemical Society (ECS), American Association for Advancement of Science (AAAS), Institute of Electrical, Electronics Engineers (IEEE) and the American Physical Society (APS) and National Academy of Inventors ( NAI)] and been elected to the Florida Inventors Hall of Fame in 2021.