基本信息
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职业迁徙
个人简介
15+ years' experience in advanced packaging, substrate/PCB/Rigid-flex/FPC fabrication, SMT & assembly;
Tech leader with embracing possibility thinking; invention disclosures and patents for various substrates and package architectures;
Delivered impressive products with notable success by managing design optimization, process development, cost reduction, and operation quality control;
Enabled the 1st IC substrate factory in China, from ground up to HVM for 10nm technology;
Certified Six Sigma Green Belt
Tech leader with embracing possibility thinking; invention disclosures and patents for various substrates and package architectures;
Delivered impressive products with notable success by managing design optimization, process development, cost reduction, and operation quality control;
Enabled the 1st IC substrate factory in China, from ground up to HVM for 10nm technology;
Certified Six Sigma Green Belt
研究兴趣
论文共 131 篇作者统计合作学者相似作者
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Lingqiao Wu, Haoran Lv,Rui Zhang,Peipei Ding,Mingxue Tang,Shiqi Liu,Lihang Wang, Fangzheng Liu,Xianwei Guo,Haijun Yu
ACS nano (2024)
Energy & Environmental Science (2024)
Small methodspp.e2301262-e2301262, (2024)
Corrosion Communications (2024)
Small (Weinheim an der Bergstrasse, Germany) (2023)
Small (Weinheim an der Bergstrasse, Germany)no. 24 (2023)
Linqi Zhang,Qi Zhang,Peng Chen,Ziqing Yang,Qining Lv,Han Wang,Rui Zhang,Ruoke Wang, Jinqian Li, Xuangling Shi, Lifen Song,Li Liu,
Research Square (Research Square) (2023)
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