René H Poelma

René H. Poelma (Senior Member, IEEE) received the Ph.D. degree (cum laude) from the Laboratory of Electronic Components Technology and Materials, Delft University of Technology, Delft, The Netherlands, in 2016. He is currently a Senior Principal Engineer specializing in new packaging technologies, materials, simulation techniques, and processes with Nexperia BV, Nijmegen, The Netherlands. He is a Guest Researcher with the Department of Microelectronics, Delft University of Technology. His research interests include advancing new packaging solutions, heterogeneous integration, and addressing challenges related to power density, device frequency, manufacturability, and reliability in high-demanding environments and applications. Dr. Poelma is the IEEE Electronics Packaging Society Chair of Benelux Chapter 8.