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Research Interests

Papers共 59 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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A Modeling Study of Stacked Cu-CNT TSV on Electrical, Thermal, and Reliability Analysis
Baohui Xu,Rongmei Chen,Jiuren Zhou,Jie Liang
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 184-191
Cited3Views0EIWOSBibtex
3
0
A Modeling Study: Applying Carbon-Based Interconnects to BS-PDN Architecture
Baohui Xu,Rongmei Chen,Jie Liang
2023 IEEE 15th International Conference on ASIC (ASICON) (2023)
Cited0Views0EIWOSBibtex
0
0
Physical design enablement of 3 dies stacked 3D-ICs
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antione Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas, Erik Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
Cited0Views0Bibtex
0
0
Design Enablement of 3-Dies Stacked 3D-Ics Using Fine-Pitch Hybrid-Bonding and TSVs
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas,Eric Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
Cited5Views0EIWOSBibtex
5
0
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Author Statistics

#Papers: 59

#Citation: 408

H-Index: 12

G-Index: 17

Sociability: 5

Diversity: 2

Activity: 7

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