Philippe Foubert - Moores UCSD Cancer Center, University of California, San Diego, San Diego, CA 92093, USA

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Recent advances in EUV patterning in preparation towards high-NA EUV

Seiji Nagahara,Arnaud Dauendorffer, Arame Thiam, Xiang Liu, Yuhei Kuwahara, Cong Que Dinh,Soichiro Okada, Shinichiro Kawakami, Hisashi Genjima, Noriaki Nagamine,Makoto Muramatsu,Satoru Shimura,

ADVANCES IN PATTERNING MATERIALS AND PROCESSES XL（2023）

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Continued Optimization of Point-Of-Use Filtration for Metal Oxide Photoresists to Reduce Defect Density

T. Kohyama,Shu-Hao Chang,Jan Doise, Michael Kocsis,Peter De Schepper,Philippe Foubert

ADVANCES IN PATTERNING MATERIALS AND PROCESSES XL (2023)

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Defectivity reduction in EUV resists through novel high-performance Point-Of-Use (POU) filters

Yiren Zhang,Toru Umeda, Hirokazu Sakakibara, Sheik Ansar Usman Ibrahim, Atsushi Sakamoto,Amarnauth Singh,Robert Shick, Karl Skjonnemand,Philippe Foubert, Waut Drent

ADVANCES IN PATTERNING MATERIALS AND PROCESSES XL (2023)

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Holistic litho-etch development to address patterning challenges towards high NA EUV

Seiji Nagahara, Arnaud Dauendorffer, Xiang Liu, Tomoya Onitsuka, Hisashi Genjima, Noriaki Nagamine, Yuhei Kuwahara,Yuya Kamei, Shinichiro Kawakami,Makoto Muramatsu, Satoru Shimura, Kathleen Nafus,

International Conference on Extreme Ultraviolet Lithography 2022 (2022)

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EUV Metal Oxide Resist Development Technology for Improved Sensitivity, Roughness and Pattern Collapse Margin for High Volume Manufacturing

Cong Que Dinh,Seiji Nagahara, Yuhei Kuwahara,Arnaud Dauendorffer,Keisuke Yoshida,Soichiro Okada, Tomoya Onitsuka, Shinichiro Kawakami,Satoru Shimura,Makoto Muramatsu,Kosuke Yoshihara,John S. Petersen,

Journal of Photopolymer Science and Technologyno. 1 (2022): 87-93

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Approaches to Enable Patterning of Tight Pitches towards High NA EUV

Hiroki Tadatomo,Arnaud Dauendorffer, Tomoya Onitsuka, Hisashi Genjima, Yasuyuki Ido,Soichiro Okada, Yuhei Kuwahara,Arisa Hara, Congque Dinh,Seiji Fujimoto, Shinichiro Kawakami,Makoto Muramatsu,

ADVANCED ETCH TECHNOLOGY AND PROCESS INTEGRATION FOR NANOPATTERNING XI（2022）

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High Performance Bulk and POU Filtration of EUV Lithography Materials