P. Sideris - Commissariat Energie Atom & Energies Alternat La, Univ Grenoble Alpes

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3D Sequential Integration with Si CMOS Stacked on 28nm Industrial FDSOI with Cu-ULK Ibeol Featuring RO and HDR Pixel

T. Mota-Frutuoso,V. Lapras,L. Brunet,L. Basset,J. Lugo,C. Fenouillet-Beranger,M. Vinet,D. Lattard,F. Boulard, Y. Exbraya, D. Boutry,O. Billoint,D. Bosch, Y. Maneglia,A. Peizerat, S. Dumas,G. Sicard,S. Kerdiles,J. Kanyandekwe,P. Sideris,V. Mazzocchi,A. Sarrazin,V. Loup,G. Mauguen,C. Morales,P. Acosta Alba,V. Balan,C. Perrot,J. Sturm,C. Euvrard,F. Aussenac, A. Janaud,J-D. Chapon,M. Guillermet, S. Guglieri,F. Bailly, P. Toresani,F. Fournel,M. Mouhdach, A. Berthoud,L-L. Chapelon,M. Ribotta,F. Ponthenier, A. Magalhaes,S. Maitrejean, C. Moulin,J. Michailos,F. Arnaud,A. Cathelin,J. Arcamone,F. Andrieu,X. Garros,F. Gaillard,P. Batude.

2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)

引用2浏览0EIWOS引用

Parasitic Coupling in 3D Sequential Integration: The Example of a Two-Layer 3D Pixel

Petros Sideris,Arnaud Peizerat,Perrine Batude,Gilles Sicard,Christoforos Theodorou

TECHNOLOGIES（2022）

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RF Performance of Devices Processed in Low-Temperature Sequential Integration

T. Mota Frutuoso,P. Sideris,J. Lugo-Alvarez,X. Garros,L. Brunet, C. Fenouille-Beranger,P. Batude,C. Theodorou,P. Ferrari,F. Gaillard

IEEE Transactions on Electron Devices（2021）

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Opportunities and Challenges Brought by 3D-Sequential Integration

2021 IEEE International Interconnect Technology Conference (IITC)pp.1-1, (2021)

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Inter-tier Coupling Analysis in Back-illuminated Monolithic 3DSI Image Sensor Pixels

Petros Sideris,Arnaud Peizerat,Perrine Batude,Christoforos Theodorou,Gilles Sicard

2021 10th International Conference on Modern Circuits and Systems Technologies (MOCAST)（2021）

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Inter-tier Electrostatic Coupling Effects in 3D Sequential Integration Devices and Circuits

P. Sideris,L. Brunet,L. Ciampolini,G. Sicard,P. Batude,C. Theodorou

SOLID-STATE ELECTRONICS（2020）

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Impact of Inter-Tier Coupling on Static and Noise Performance in 3D Sequential Integration Technology

Petros Sideris,Laurent Brunet,Gilles Sicard,Perrine Batude,Christoforos Theodorou

2019 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Si...（2019）

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Impact of Inter-Tier Coupling on Static and Noise Performance in 3D Sequential Integration Technology

P. Sideris,Laurent Brunet,Gilles Sicard,P. Batude,Christoforos Theodorou

Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Siliconpp.1-4, (2019)

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Inter-tier Dynamic Coupling and RF Crosstalk in 3D Sequential Integration

P. Sideris,J. Lugo-Alvarez,P. Batude,L. Brunet,P. Acosta-Alba,S. Kerdiles,C. Fenouillet-Beranger,G. Sicard,O. Rozeau,F. Andrieu,J-P. Colinge,G. Ghibaudo,C. Theodorou

IEEE Conference Proceedings（2019）

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