P. Rivallin - CEA Leti | 人才画像

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论文共 48 篇作者统计合作学者相似作者

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A Novel Dual Isolation Scheme for Stress and Back-Bias Maximum Efficiency in Fdsoi Technology

R. Berthelon,F. Andrieu,P. Perreau,D. Cooper,F. Roze,O. Gourhant,P. Rivallin,N. Bernier,A. Cros,C. Ndiaye,E. Baylac,E. Souchier,D. Dutartre,A. Claverie,O. Weber,E. Josse,M. Vinet,M. Haond

2016 IEEE INTERNATIONAL ELECTRON DEVICES MEETING (IEDM) (2016)

引用6浏览0EIWOS引用

mulation of Stress Engin in Highly Strained p-typ ETs for 14-nm Node and

A Idrissiel Oudrhiri,S Martinie,C Le Royer,Laurent Grenouillet,P Rivallin,M Casse,Mireille Mouis, Grenoble Alpes

mag（2015）

引用23浏览0引用

Mulation of Stress Engin in Highly Strained P-Typ ETs for 14-Nm Node And

A. I. Oudrhiri,S. Martinie, C. L. Royer,L. Grenouillet,P. Rivallin,M. Cassé,M. Mouis, Grenoble Alpes

semanticscholar（2015）

引用0浏览0引用

Mechanical Simulation of Stress Engineering Solutions in Highly Strained P-Type FDSOI MOSFETs for 14-Nm Node and Beyond

A. Idrissi-El Oudrhiri,S. Martinie,J-C. Barbe,O. Rozeau,C. Le Royer,M-A. Jaud,J. Lacord,N. Bernier,L. Grenouillet,P. Rivallin,J. Pelloux-Prayer,M. Casse,M. Mouis

2015 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)（2015）

引用1浏览0EIWOS引用

NANOWIRE SEMICONDUCTOR DEVICE PARTIALLY SURROUNDED BY A GRATING

Sylvain Barraud,P Rivallin,P Scheiblin

mag（2015）

引用23浏览0引用

Mechanical Sim Solutions

A. Idrissi-El Oudrhiri,S. Martinie, B J-C., Rozeau,C. Le Royer,M-A. Jaud, L J.,N. Bernier,L. Grenouillet,P. Rivallin, J., Prayer,M. Cassé,M. Mouis, O., Acord

semanticscholar（2015）

引用0浏览0引用

(Invited) Annealing Techniques for Low Temperature Junctions Design in a 3D VLSI Integration

Extended Abstracts of the 2015 International Conference on Solid State Devices and Materials (2015)

引用0浏览0引用

Smart Co-Integration of Light Sensitive Layers with FDSOI Transistors for More Than Moore Applications

L. Grenouillet,B. De Salvo,L. Brunet,J. Coignus,C. Tabone,J. Mazurier,C. Le Royer,P. Grosse,M. A. Jaud,P. Rivallin,Z. Chalupa,O. Rozeau,O. Faynot,M. Vinet

2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (2014)

引用16浏览0EIWOS引用

Low temperature junction formation by solid phase epitaxy on thin film devices: Atomistic modeling and experimental achievements

B Sklenard,P Batude,L Pasini,C Fenouilletberanger,B Previtali,M Casse,L Brunet,P Rivallin,J C Barbe,C Tavernier,Sorin Cristoloveanu,M Vinet,Ignacio Martinbragado

Junction Technology（2014）

引用2浏览0EIWOS引用

Nfet FDSOI Activated by Low Temperature Solid Phase Epitaxial Regrowth: Optimization Guidelines

L. Pasini,P. Batude,M. Casse,L. Brunet,P. Rivallin,B. Mathieu,J. Lacord,S. Martinie,C. Fenouillet-Beranger,B. Previtali,N. Rambal,M. Haond,G. Ghibaudo,M. Vinet

2014 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S) (2014)

引用9浏览0EIWOS引用

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