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Omri Tayyara (Graduate Student Member, IEEE) received the bachelor’s degree in 2017 from Cleveland State University, Cleveland, OH, USA, and the master’s degree in 2018 from the University of Toronto, Toronto, ON, Canada, both in mechanical engineering, where he is currently working toward the Ph.D. degree in mechanical engineering with Advanced Thermal/Fluids Optimization, Modelling, and Simulation (ATOMS) Laboratory, under the supervision of Prof. Cristina Amon.
He is also a member of the University of Toronto Electric Vehicle Research Centre (UTEV), headed by Prof. Olivier Trescases, who is his cosupervisor. His research is focused on developing optimal thermal management systems for high-power converter modules for electric vehicle (EV) fast charging, for both on-board and stationary chargers, through means of experimental studies and multiphysics computational simulations, coupling multiobjective adjoint optimization methodologies to tackle the critical constraints of the conservatively designed cooling system of today’s fast chargers. His master’s research work focused on CFD modeling of turbulent downstream wakes propagated by large-scale wind turbines. In his undergrad, he designed and developed a quadrotor drone system for the application of measuring wind data for onshore and offshore wind farms.
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论文共 11 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
International Journal of Heat and Mass Transfer (2023): 124421-124421
2023 IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, APECpp.1808-1815, (2023)
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2023)
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2022 IEEE Applied Power Electronics Conference and Exposition (APEC)pp.312-318, (2022)
C. Lamoureux, Z. Gong, M. Nasr, S. A. Assadi,K. Gupta,D. Galatro,O. Tayyara,C. da Silva,C. Amon,O. Trescases
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2019 (2020)
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