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Nakul Pande (Member, IEEE) received the B.Tech. degree in electronics and communication engineering from the Institute of Engineering and Technology, Lucknow, India, in 2010, the M.Tech. degree in electrical engineering from the Indian Institute of Technology Bombay, Mumbai, India, in 2013, and the Ph.D. degree in electrical engineering from the University of Minnesota (Twin Cities), Minneapolis, MN, USA, in 2020. He is currently working as an SRAM Design Engineer with Apple Inc., Santa Clara, CA, USA. He has authored or coauthored over ten conference/journal articles focusing on diverse aspects of integrated circuit reliability, ranging from wearout mechanisms at the device level to interconnect reliability and radiation induced soft errors in logic. His current research interests include the design of digital and mixed-signal circuits including high performance data converters, memory circuits, and high speed I/O and on-chip hardware monitors targeting statistically efficient reliability characterization.
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IEEE Transactions on Device and Materials Reliabilityno. 2 (2023): 233-240
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