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个人简介
He developed highly scaled lateral and vertical nanowire gate-all-around FETS, NVM devices and high efficiency silicon solar cells. Prior to that Dr Singh worked on lithography technology development for 9 years [1996–2004] focusing on resolution enhancement techniques. Dr. Singh has authored or co-authored more than 190 technical papers (citations > 1900 & h-index: 22) in referred archival journals and conferences and has filed more than 20 technology disclosures. His nanowire gate-all-around FET papers have been selected for pre-conference publicity by IEDM and SSDM conferences. He is a recipient of George E. Smith Award 2007 for best paper in IEEE Electron Device Letters, Singapore National Technology Award 2008 for his outstanding contributions to the research and development of nanowire-technology platform, enabling the realization of ultimately scaled CMOS integrated circuits and new class of electronic bio-sensors, IME Excellence Award 2009 for industry project developing Surround Gate Transistor (SGT) technology, and A*STAR TALENT award 2010 for Leading, Educating and Nurturing Talents.
研究兴趣
论文共 364 篇作者统计合作学者相似作者
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Hong Cai,Bo Li,Yiding Lin, Haitao Yu, Steven Hou Jang Lee, Chin Khang Tew, Jae Ok Yoo, Charmaine Goh, Shervonne Woon,Doris Keh Ting Ng,Navab Singh,Xianshu Luo,
Advanced Fabrication Technologies for Micro/Nano Optics and Photonics XVII (2024)
Hemanth Kuamr Cheemalamarri, Gim Guan Chen, Hongyu Li, Chandra Rao Bhesetti,Nagendra Sekhar Vasarla, Nandini Venkataraman, King Jien Chui, Srinivasa Rao Vempati,Navab Singh
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
Arvind Sundaram, Chin Khang Tew, Guo Wei Tan,Yuan-Hsing Fu,Hongyu Li,Nandini Venkataraman, Bhesetti Chandra Rao,Navab Singh
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1150-1155, (2023)
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Nandini Venkataraman, Benedikt Risse, Gregorio Decierdo,Navab Singh,Darshini Senthilkumar, Deepthi Kandasamy,Eng Huat Toh,Louis Lim
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1524-1530, (2023)
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2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.135-138, (2023)
Hemanth Kumar Cheemalamarri, Binni Varghese,Sharma Jaibir,Li Hongyu, Chandra S. S. Rao,Navab Singh,Vempati Srinivasa Rao,King-Jien Chui
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1725-1729, (2023)
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Umesh Chand, L. K. Bera,Navab Singh, Kijeong Han, Voo Qin Gui Roth, Calvin Hung Ming Chua,Surasit Chung
Materials Science Forum (2023): 165-169
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Materials Science Forum (2023): 141-145
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Hemanth Kumar Cheemalamarri, Steven Lee Hou Jang, Ji Hong Miao, Nandini V, Chandra Rao B S S, Chui King Jien,Vempati Srinivasa Rao,Navab Singh
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.625-628, (2023)
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