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个人简介
His research interest are the material and process for flip chip, 2.5D/3D TSV IC, Optoelectronic and MEMS package, wafer level package and PoP through design, fabrication, assembly process, reliability testing and modeling works.
He is Senior member of the IEEE EPS society, and has been member of Materials and Processing sub-committee in IEEE Electronic Components and Technology Conference (ECTC) since 2011 and served as the webmaster and Vice Chair of CPMT Society Technical Committee 5 - Materials & Processing, and served as assistant program chair of Advanced Packaging Material Symposium, 2013.
Dr. Yim received the Outstanding Young Engineer Award from IEEE EPS society (2007) and the Engineer of the Year Award from IEEE Phoenix Session (2009).
He is Senior member of the IEEE EPS society, and has been member of Materials and Processing sub-committee in IEEE Electronic Components and Technology Conference (ECTC) since 2011 and served as the webmaster and Vice Chair of CPMT Society Technical Committee 5 - Materials & Processing, and served as assistant program chair of Advanced Packaging Material Symposium, 2013.
Dr. Yim received the Outstanding Young Engineer Award from IEEE EPS society (2007) and the Engineer of the Year Award from IEEE Phoenix Session (2009).
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2017 IEEE 67th Electronic Components and Technology Conference (ECTC)pp.1340-1347, (2017)
Components, Packaging and Manufacturing Technology, IEEE Transactionsno. 7 (2012): 1059-1063
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