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Research
We aim to establish a new multidisciplinary field that fuses semiconductor engineering, integrated circuit engineering, computer engineering, and neuroscience. To this end, we are conducting studies on new low-power high-performance semiconductor devices and integrated circuits, superchips (3-dimensional integrated circuits), neuro-machine fusion devices (ν BMD), implantable devices, and brain-machine interfaces, all of which incorporate the information processing algorithms in brains and nervous systems. From these studies, we are seeking to create new industries based on device and information technologies, as well as robot control technologies that relate to the human brain and nervous system. In addition, making full use of these technologies, we also aim to contribute to the development of new diagnostic medical technologies that are centered on the brain and nervous system. We show specific examples below.
We aim to establish a new multidisciplinary field that fuses semiconductor engineering, integrated circuit engineering, computer engineering, and neuroscience. To this end, we are conducting studies on new low-power high-performance semiconductor devices and integrated circuits, superchips (3-dimensional integrated circuits), neuro-machine fusion devices (ν BMD), implantable devices, and brain-machine interfaces, all of which incorporate the information processing algorithms in brains and nervous systems. From these studies, we are seeking to create new industries based on device and information technologies, as well as robot control technologies that relate to the human brain and nervous system. In addition, making full use of these technologies, we also aim to contribute to the development of new diagnostic medical technologies that are centered on the brain and nervous system. We show specific examples below.
研究兴趣
论文共 517 篇作者统计合作学者相似作者
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2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-4, (2023)
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2023 IEEE International 3D Systems Integration Conference (3DIC)pp.1-4, (2023)
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3DICpp.1-4, (2023)
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Journal of Biological Chemistrypp.104726, (2023)
2022 IEEE International Meeting for Future of Electron Devices, Kansai (IMFEDK)pp.1-4, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.317-323, (2022)
Murugesan Mariappan, Shizu Fukuzumi,Tomoaki Shibata, Hiroyuki Hashimoto,JiChel Bea,Mitsumasa Koyanagi,Takafumi Fukushima
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.1138-1143, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.685-690, (2022)
Optogenetics (2021): 141-151
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