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浏览量:12
职业迁徙
个人简介
He received the 2018 Influential ISCA Paper Award (For 2003 paper "Temperature-aware microarchitecture"), the NSF CAREER award in 1997 and was a co-author on best paper awards at ASILOMAR19, LASCAS19, SELSE17, ISQED08, GLSVLSI06, ISCA03 and SHAMAN02 and IEEE Micro Top Picks in 2008 and 2003. He gave keynotes at NILES22, DCAS18, SOCC16, CogArch16, WoNDP15, iNIS15 and CNNA14. He was the chair of the VSA-TC of IEEE CAS in 2005-2007, general chair for ISLPED06 and GLSVLSI04, TPC chair for SOCC18, ISVLSI17, NanoNets07 and ISLPED05, and on technical committees for numerous conferences. He is Editor-in-Chief for the IEEE TVLSI, and was Senior Editor for the IEEE TNano 2015-2022, AE for the IEEE TNano in 2012-2014, IEEE Design & Test in 2016-2022, IEEE TCAS I in 2004-2008 and for the IEEE TVLSI in 2001-2003. He was Guest Editor for the IEEE Computer special issue on Power-Aware Computing in December 2003 and a Distinguished Lecturer for the IEEE Circuits and Systems (CAS) Society in 2020-2021, 2012-2013 and 2004-2005, and for the Solid-State Circuits Society (SSCS) in 2007-2008. Prof. Stan is a fellow of the IEEE, a member of ACM, and of Eta Kappa Nu, Phi Kappa Phi and Sigma Xi. His h-index is 56 and his i10-index is 157.
研究兴趣
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arxiv(2024)
IEEE Trans. Very Large Scale Integr. Syst.no. 8 (2023): 1087-1113
2023 24th International Symposium on Quality Electronic Design (ISQED)pp.1-8, (2023)
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IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSno. 12 (2023): 1879-1881
Elisa Pantoja,Mircea Stan
2023 IEEE 14th Annual Ubiquitous Computing, Electronics & Mobile Communication Conference (UEMCON)pp.0632-0636, (2023)
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IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSno. 12 (2023): 1896-1904
2023 IEEE 36th International System-on-Chip Conference (SOCC)pp.1-6, (2023)
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RFIDpp.54-59, (2023)
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FPGApp.129-136, (2023)
GLSVLSI '23: Proceedings of the Great Lakes Symposium on VLSI 2023pp.467-471, (2023)
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