基本信息
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Bio
Mian Tao received the bachelor’s degree in material science and Engineering from the South China University of Technology, Guangzhou, China, and the M.Sc. degree in mechanical engineering and the Ph.D. degree from the Hong Kong University of Science and Technology (HKUST), Hong Kong, in 2010 and 2017, respectively. His doctoral thesis was about thermal characterization of flip-chip LEDs.
From 2011 to 2013, he was with the HKUST LED-FPD Technology R&D Center, Foshan, China, where he focused on the area of optical, thermal, and electrical characterization of light-emitting diode chips and devices. His current research interests include the development and characterization of advanced electronic packaging.
Research Interests
Papers共 34 篇Author StatisticsCo-AuthorSimilar Experts
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Ji Shu, Heng Wang,Mian Tao,Yat Hon Ng,Sirui Feng, Yangming Du, Zongjie Zhou,Jiahui Sun,Shi Wei Ricky Lee,Kevin J. Chen
IEEE Transactions on Electron Devicesno. 99 (2025): 1-7
2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)pp.33-34, (2025)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2025): 1-1
2024 36TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC S, ISPSD 2024pp.486-489, (2024)
openalex(2024)
Hua Xu,Jeffery C. C. Lo,Xing Qiu,Yuanjie Cheng,Mian Tao,S. W. Ricky Lee, Lawrence C. L. Ko, Ho Ki Yeung, Chun Ho Yau
PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023 (2023)
2023 IEEE CPMT Symposium Japan (ICSJ)pp.21-24, (2023)
2023 International Conference on Electronics Packaging (ICEP)pp.135-136, (2023)
crossref(2021)
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Author Statistics
#Papers: 34
#Citation: 300
H-Index: 9
G-Index: 17
Sociability: 5
Diversity: 2
Activity: 3
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