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Max C. Modugno received the B.S. degree in ceramic engineering from Alfred University, Alfred, NY, USA, in 2015. He is currently pursuing the M.S. degree with Alfred University, Alfred, NY, USA.
He was a Co-Op Student at the ALCOA Technical Center, New Kensington, PA, USA, in 2014, and was a Teaching Assistant and a Research Assistant while he was a undergraduate student. He was an Oak Ridge Associated Universities (ORAU), Oak Ridge, TN, USA, Post-B.S. Research Associate with the Electrical and Electronics Systems Research Division, Oak Ridge National Laboratory (ORNL), Oak Ridge, in 2015, where he assisted with research pertaining to the processing, test method development, and mechanical testing of sintered-silver interconnection systems. He is currently a Post-B.S. Research Associate with ORAU and also with the Materials Science and Technology Division, ORNL, where he contributes to sintering science research. He has authored a proceedings paper, has coauthored a proceedings paper, has several other pending publications, and has presented at a technical conference.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 12 (2017): 2079-2086
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