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个人简介
Matthias Hutter received the Dipl.-Ing. degree in materials science and technologies from the University of Erlangen, Erlangen, Germany, in 1997, and the Dr.-Ing. degree from the Technical University of Berlin, Berlin, Germany, in 2009.
Since 1997, he has been a Research and Development Engineer, Project Manager, and Group Manager with the Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, where he is involved in the field of microelectronics packaging. He is currently a Group Manager for metallic interconnection technologies, Fraunhofer-IZM. His current research interests include the development of solder interconnection technologies and Ag sintering technologies, especially in optoelectronic and RF, power electronics, and board interconnection.
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Brian Curran, Jacob Reyes,Christian Tschoban,Jan Höfer,Arian Grams, Felix Wust,Matthias Hutter,Jens Leib,Marta Martínez-Vázquez,Rens Baggen,Ivan Ndip,Klaus-Dieter Lang
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