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个人简介
Mark Shaw received the B.Sc.(Hons.) degree in applied physics from
the Univeristy of Wales, Cardifff, U.K., in 1984. He was with Avanex, Bookham, Mesophotonics, Pirelli, Nortel, and
Plessey, where he had various optoelectronics packaging engineering roles. In 2006, he joined STMicroelectronics
working on MEMS packaging, where he is currently responsible for the development of silicon photonics packaging
solutions within the Digital and Mixed Processes ASIC Division. He is the Author of several published articles and has
been granted numerous patents in the field of packaging particularly in optoelectronics and MEMS.
研究兴趣
论文共 12 篇作者统计合作学者相似作者
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Marco Del Sarto,Luca Maggi,Amedeo Maierna,Mark Shaw,Roberto Carminati,Gianluca Mendicino,Davide Rotta,Marco Chiesa, Aina Serrano Rodrigo, Antonella Bogoni
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-5
Dominica Giusti,Alex Gritti,Fabio Quaglia,Alessandro Stuart Savoia, Hideyuki Sandoh, Gerald Klug, Hitoshi Hoshino,Dutta Rahul,Vempati Srinivasa Rao,David Ho Soon Wee, Masatoshi Wakahara,Mark Shaw
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1442-1449, (2023)
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Andrea Ratti, Daniele Simoncini, Annabel Adolfo, Marco Del Sarto,Alex Gritti,Patrick Fedeli,Luca Maggi, Teresa Napolitano,Mark Andrew Shaw,Jefferson Talledo
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)no. EMPC (2023): 1-6
2022 IEEE INTERNATIONAL ULTRASONICS SYMPOSIUM (IEEE IUS)pp.1-4, (2022)
Massimo Fere, Livio Gobbato, Matteo Tremolada,Mark Andrew Shaw,O. Kermarrec,Carine Besset, Roberto Curti, Fabio Pietro Fiabane,Xueren Zhang
Fr d ric Boeuf,S bastien Cr mer,Enrico Temporiti,Massimo Fer ,Mark Shaw,Charles Baudot,Nathalie Vulliet,Thierry Pinguet,Attila Mekis,Gianlorenzo Masini, Herve Petiton,Patrick Le Maitre,
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Microelectronics Packaging Conferencepp.1-6, (2013)
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