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个人简介
Professor Swaminathan has over 250 publications in refereed journals and conferences, has co-authored 3 book chapters, has 11 issued patents and has 6 patents pending. While at IBM, he reached the second invention plateau. He served as the Co-Chair for the 1998 and 1999 IEEE Topical Meeting on Electrical Performance of Electronic Packaging (EPEP), served as the Technical and General Chair for the IMAPS Next Generation IC & Package Design Workshop, serves as the Chair of TC-12, the Technical Committee on Electrical Design, Modeling and Simulation within the IEEE CPMT society and was the Co-Chair for the 2001 IEEE Future Directions in IC and Package Design Workshop. He is the co-founder of the IMAPS Next Generation IC & Package Design Workshop and the IEEE Future Directions in IC and Package Design Workshop. He also serves on the technical program committees of EPEP, Signal Propagation on Interconnects workshop, Solid State Devices and Materials Conference (SSDM), Electronic Components and Technology Conference (ECTC), and International Symposium on Quality Electronic Design (ISQED).
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论文共 147 篇作者统计合作学者相似作者
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2023 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION, NEMOpp.147-150, (2023)
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2023 IEEE Radio and Wireless Symposium (RWS)pp.98-100, (2023)
Polymersno. 19 (2023): 3895-3895
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2023 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)pp.1-1, (2023)
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Xingchen Li,Xiaofan Jia,Kyoung-sik Moon,Joon Woo Kim,Aadit Pandey, Anthony Chiu, Andrew Kenerson,Madhavan Swaminathan
2023 IEEE Radio and Wireless Symposium (RWS)pp.129-131, (2023)
IEEE Transactions on Terahertz Science and Technologyno. 3 (2023): 270-279
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.62-66, (2022)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1342-1348, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.377-383, (2022)
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