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个人简介
Before joining Georgia Tech, he worked on supercomputer packaging at IBM. He is the author of more than 450 technical publications, holds 29 patents, and is the lead author and co-editor of 3 books (Power Integrity Modeling and Design for Semiconductors and Systems, Prentice Hall, 2007; Introduction to System on Package, McGraw Hill, 2007). 2008; and Design and Modeling of 3D ICs and Interposers, WSP, 2013), founder and co-founder of two startups (E-System Design and Jacket Micro Devices), and International IEEE Conference (Advanced Packaging and Systems The founder of Electrical Design - EDAPS).
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论文共 609 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMSno. 3 (2024): 401-412
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2023): 1533-1544
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2023): 1520-1523
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Mandovi Mukherjee,Nael Mizanur Rahman,Coleman DeLude, Joseph Driscoll,Uday Kamal,Jongseok Woo,Jamin Seo,Sudarshan Sharma, Xiangyu Mao,Payman Behnam,Sharjeel Khan,Daehyun Kim,
2023 IEEE RADAR CONFERENCE, RADARCONF23pp.1-6, (2023)
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Madhavan Swaminathan, William E. Leonhard
IMAPSource Proceedingsno. DPC (2023)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2023): 291-299
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.147-151, (2023)
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2023 International Applied Computational Electromagnetics Society Symposium (ACES)pp.1-2, (2023)
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