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He is involved in various aspects of wafer-level packaging, lead-free and halogen-free, thermal measurement and modeling, design-for-manufacturability, design-for-reliability, high voltage, and sensors. He co-edited two books on packaging, and has authored or coauthored over 200 publications. He holds over 70 patents and invention disclosures.,Dr. Nguyen received many awards from CPMT, IMAPS, and SRC. He is a Fellow of the ASME and a Fulbright Scholar.
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 9 (2020): 1534-1541
PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2018 (2019)
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