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个人简介
His main research contributions are in the theoretical analysis and in the computational investigation of electric circuits and electromagnetic fields. In his research on heat transfer and thermal management of electronic components, he has introduced original industrial-strength approaches to the extraction of compact thermal models, currently available in market leading commercial software. In his research areas, he has authored or coauthored over 200 papers in refereed international journals and conference proceedings. For these activities, he received the Harvey Rosten Award for Excellence, in 2016. He has also been serving as the Chair of the conference THERMal INvestigation of Integrated Circuits (THERMINIC). He has been serving as an Associate Editor for the IEEE Transactions of Components, Packaging and Manufacturing Technology.
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IEEE Journal of Microwavesno. 99 (2024): 1-10
IEEE Transactions on Microwave Theory and Techniquesno. 4 (2023): 1458-1466
2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINICpp.1-7, (2023)
2023 International Conference on Clean Electrical Power (ICCEP)pp.355-361, (2023)
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2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD)pp.310-313, (2023)
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ELECTRONICSno. 16 (2023): 3471-3471
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2023 IEEE International Conference on Electrical Systems for Aircraft, Railway, Ship Propulsion and Road Vehicles & International Transportation Electrification Conference (ESARS-ITEC)pp.1-6, (2023)
JOURNAL OF ENERGY STORAGE (2023): 109202-109202
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