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个人简介
Lei Jiang received the Ph.D. degree in mechanical engineering from the University of Michigan, Ann Arbor, MI, USA, in 1998.
He joined Intel Corporation, Hillsboro, OR, USA, in 1998, where he is currently a Principal Engineer of Logic Technology Development and drives innovations in thermal, power, and reliability model, and validation on leading process technologies. His previous experience includes fluid mechanics, process technology modeling, and pathfinding research. He has authored over 30 publications and holds six U.S. patents. His current research interests include device and nanoscale heat transfer, thermal-mechanical, and thermal-power validation in advanced IC design.
Dr. Jiang is a member of the American Society of Mechanical Engineers.
研究兴趣
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2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC)pp.144-+, (2020)
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Kyoto, Japanpp.28-29E, (2009)
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2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05no. null (2006): 1-4E
MICROpp.469-+, (2006)
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