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职业迁徙
个人简介
He has approximately 15 years of industy experience at Intel and VLSI Technology Inc. He contributed to a number of miroprocessor and chipset designs and was most recently a principal engineer and circuit design manager for the Xscale microprocessors. He also worked on compact modeling, reliability modeling and CMOS imagers.
His areas of expertise include low power high performance VLSI radiation hardening and harsh environment VLSI CAD and device behavior for VLSI.
His areas of expertise include low power high performance VLSI radiation hardening and harsh environment VLSI CAD and device behavior for VLSI.
研究兴趣
论文共 272 篇作者统计合作学者相似作者
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IEEE Transactions on Device and Materials Reliabilityno. 1 (2023): 162-171
Ryan Melendez, Leonardo Martinez,Lawrence T. Clark,Cliff S. YoungScioritino,Steven M. Guertin,Jean Yang-Scharlotta
2023 IEEE Radiation Effects Data Workshop (REDW) (in conjunction with 2023 NSREC)pp.1-4, (2023)
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Lawrence T. Clark,Clifford S. YoungSciortino,Maximilian Siath, Leonardo Martinez,William E. Brown, Shayena Khandker, Azad Derbedrosian, Sungho Kim,Ryan Melendez,Steven M. Guertin,Jean Yang-Scharlotta
2022 IEEE International Integrated Reliability Workshop (IIRW)pp.1-4, (2022)
Clifford YoungSciortino,Jereme Neuendank,Lawrence T. Clark,Hugh Barnaby,Donald Wilson,Matthew Spear,Aymeric Privat,Matthew J. Marinella
2022 22nd European Conference on Radiation and Its Effects on Components and Systems (RADECS)pp.1-6, (2022)
2022 IEEE Aerospace Conference (AERO)pp.1-11, (2022)
IEEE Transactions on Nuclear Scienceno. 12 (2022): 2305-2313
Jean Yang-Scharlotta,Steven M. Guertin,Lawrence T. Clark,Clifford S. Young-Sciortino,Jim D. Butler, Mohammad Mojarradi, Harald Schone
2022 IEEE Aerospace Conference (AERO)pp.1-10, (2022)
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