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Kyungjune Son (Student Member, IEEE) received the B.S. and M.S. degrees in electrical engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, in 2016 and 2018, respectively, where he is currently pursuing the Ph.D. degree.
His current research interests include the design and analysis of 3-D cross-point (X-Point) memory for high-performance server platform considering signal integrity.
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论文共 37 篇作者统计合作学者相似作者
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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITYno. 1 (2024): 256-269
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 11 (2022): 1748-1756
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
2021 IEEE 30th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2021)
2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)pp.1-3, (2021)
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