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个人简介
Kuo-Ning Chiang (F'13) is currently a Chaired Professor with National Tsing Hua University. He is the author of more than 300 technical papers in international journals and conference proceedings and he own more than 40 patents. His vision and research performance drives to establish a “Design on Simulation (DOS)”-based development procedure for advanced packaging products such as WLCSP and 3D packages. He has collaborated with many electronic packaging houses, and semiconductor and LED companies such as ACET, TSMC, UMC, EPISTAR (LED), VIA, etc.
Prof. Chiang is the Co-Editor-in-Chief of
IEEE Transactions on Components, Packaging and Manufacturing Technology and the Editor-in-Chief of
Journal of Mechanics.
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论文共 264 篇作者统计合作学者相似作者
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JOURNAL OF MECHANICS (2023): 183-190
Z. Shu,K. N. Chiang
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
Materials (Basel, Switzerland)no. 14 (2023): 4922-4922
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
H. L. Chen,K. N. Chiang
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2023)
MATERIALSno. 11 (2022): 3897
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
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