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William P. King
教授
Department of Biomedical and Translational Sciences
Carle Illinois College of Medicine, University of Illinois at Urbana-Champaign;Department of Mechanical Science and Engineering, Grainger College of Engineering, University of Illinois at Urbana-Champaign;Department of Electrical and Computer Engineering, University of Illinois at Urbana-Champaign;Department of Materials Science and Engineering, University of Illinois at Urbana-Champaign;SyBridge Technologies;EDM Intelligent Solutions
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个人简介
Dr. King’s research focuses on manufacturing and advanced materials, microsystems and nanotechnology, and heat transfer. Technologies developed in his laboratory are widely used in the in the automotive, medical, aerospace, pharmaceutical, and semiconductor industries to develop new materials and product designs and to support manufacturing processes. Dr. King has published 266 journal articles and holds 20 U.S. patents.
Dr. King’s awards include the PECASE award from the White House and the ASME Gustus-Larson Award for accomplishment in Mechanical Engineering. He is a Fellow of the American Society of Mechanical Engineers (ASME), the American Association for the Advancement of Science (AAAS), the American Physical Society (APS), the Institute of Electrical and Electronics Engineers (IEEE), SME International (formerly Society of Manufacturing Engineers), and the National Academy of Inventors (NAI).
Dr. King’s awards include the PECASE award from the White House and the ASME Gustus-Larson Award for accomplishment in Mechanical Engineering. He is a Fellow of the American Society of Mechanical Engineers (ASME), the American Association for the Advancement of Science (AAAS), the American Physical Society (APS), the Institute of Electrical and Electronics Engineers (IEEE), SME International (formerly Society of Manufacturing Engineers), and the National Academy of Inventors (NAI).
研究兴趣
论文共 427 篇作者统计合作学者相似作者
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Miles V. Bimrose,Tianxiang Hu,Davis J. McGregor, Jiongxin Wang,Sameh Tawfick,Chenhui Shao,Zuozhu Liu,William P. King
Journal of Intelligent Manufacturingpp.1-15, (2024)
ADDITIVE MANUFACTURING LETTERS (2024): 100200
Additive Manufacturing Letters (2024): 100200
APPLIED PHYSICS LETTERSno. 12 (2024)
APPLIED THERMAL ENGINEERING (2024): 122127
Materials Today Communications (2023): 106417-106417
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
Rachel C. McAfee,Michael C. Fish,Adam A. Wilson, Harvey H. Tsang, Jonathan A. Boltersdorf,Soonwook Kim,Nenad Miljkovic,William P. King
ACS Applied Engineering Materialsno. 11 (2023): 2847-2857
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