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Materials, fabrication processes, characterization metrology, and design-oriented models have been developed and improved to support the integration technologies. Wide bandgap semiconductor chips, encapsulants, substrates, soldered bonds, and sintered bonds have been characterized and modeled up to 250°C for high-temperature power electronics. Modeling includes not only electrical performance, but also thermal behavior and thermo-mechanical reliability. Techniques to synthesize magnetic materials with high resistivity and low hysteresis loss are investigated for high-density converters operating at 5 MHz. Distributed magnetic structures with high, uniform energy density have been demonstrated with at least two times reduction in size compared to conventional structures. MEMS-based processes are then employed to integrate the passive materials and components into semiconductor wafers carrying power converters.
As an instructor, Khai Ngo has taught courses in electronics, energy systems, power electronics, packaging, and integrated product-process design. The electronic courses cover the use of microelectronics and integrated circuits for analog applications, such as amplification, filtering, and signal processing. The energy systems courses cover transformers, relays, motors, generators - the basic building blocks of a power system. The packaging course covers the material, process, thermal, mechanical, and electrical issues in electronic packaging. The power electronic courses cover high-frequency components, power conversion topology, and control. The integrated product-process design courses take the students through all productization stages, from customers' needs to concept generation, manufacturing, and marketing.
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IEEE Transactions on Power Electronicsno. 99 (2024): 1-5
IEEE Transactions on Power Electronicsno. 8 (2023): 9685-9694
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IEEE Transactions on Electron Devicesno. 2 (2023): 633-639
CIPS 2022; 12th International Conference on Integrated Power Electronics Systemspp.1-5, (2022)
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2022 IEEE Electrical Insulation Conference (EIC)pp.439-442, (2022)
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