基本信息
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职业迁徙
个人简介
Prolific inventor with 1700+ issued US patents, and 2400+ worldwide issued patents
100+ peer-referred journal articles and conference presentations, including invited/highlighted presentations at VLSI Symposia and IEDM
Deep knowledge in semiconductor process integration, device physics, and materials science
Inspiring and mentoring young engineers/scientist on invention
A team leader with excellent communication and mentoring skills in highly diverse organizations
A fast learner on emerging technologies
IEEE Fellow
研究兴趣
论文共 174 篇作者统计合作学者相似作者
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ADVANCED INTELLIGENT SYSTEMSno. 5 (2022): n/a-n/a
K. Motoyama,O. van der Straten,J. Maniscalco,K. Cheng, S. DeVries,H. Huang, T. Shen,N. Lanzillo, S. Hosadurga, K. Park, T. Bae, H. Seo,
2020 IEEE International Interconnect Technology Conference (IITC)pp.13-15, (2020)
J. Li,Y. Kim,D. Kong,K. Cheng,S. -C. Seo, C. Robinson, N. Saulnier,R. R. Robison, A. J. Varghese,I. Ahsan,R. Muralidhar,T. Ando,
International Symposium for Testing and Failure AnalysisISTFA 2020: Papers Accepted for the Planned 46th International Symposium for Testing and Failure Analysis (2020)
2018 IEEE International Reliability Physics Symposium (IRPS)pp.6E.1-1-6E.1-6, (2018)
引用2浏览0EIWOS引用
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ECS Meeting Abstractsno. 22 (2018): 1371-1371
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