基本信息
浏览量:1
职业迁徙
个人简介
Joon Woo Kim received the bachelor’s degree in mechanical engineering from the University of Missouri, Columbia, MO, USA, in 2017, and the master’s degree in mechanical engineering from the University of California at Berkeley, Berkeley, CA, USA, in 2018. He pursued the Ph.D. degree in mechanical engineering at the Microelectronics and Emerging Technologies Thermal Laboratory, Georgia Institute of Technology, Atlanta, GA, USA. He is currently pursuing the Ph.D. degree in electrical engineering degree with the 3D Systems Packaging Research Center, Georgia Institute of Technology.
His research interests include assembly/process for advanced packaging and energy storage devices with a focus on heterogeneous integration targeting applications, thermal analysis, thermal management of electronics, and the temperature prediction of electric machines.
研究兴趣
论文共 6 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2247-2254, (2023)
引用0浏览0EIWOS引用
0
0
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1609-1613, (2023)
引用0浏览0EIWOS引用
0
0
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1939-1943, (2023)
引用0浏览0EIWOS引用
0
0
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 2 (2023): 219-229
Xingchen Li,Xiaofan Jia,Kyoung-sik Moon,Joon Woo Kim,Aadit Pandey, Anthony Chiu, Andrew Kenerson,Madhavan Swaminathan
2023 IEEE Radio and Wireless Symposium (RWS)pp.129-131, (2023)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.377-383, (2022)
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn