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个人简介
John H. L. PANG is Professor at the School of Mechanical and Aerospace Engineering of Nanyang Technological University Singapore. He received his PhD degree in 1989 and BSc degree in 1985 from the University of Strathclyde, Glasgow, UK. He joined Nanyang Technological University in 1990. His academic interests are in Materials-Process-Performance (MPP) evaluations in Laser Cladding and Additive Manufacturing, Mechanics of Lead-Free Solder Materials, Design for Reliability (DFR), Fatigue Analysis of Welded Joints. He has published over 192 peer-reviewed journal and technical conference papers and has a SCI Web-of-Science (PANG JHL OR PANG HLJ), h-Index of 33, and over 3400 citations. He serves in the Editorial Advisory Board of the International Journal of Fatigue. He had served as Associate Editor in the IEEE Transactions on Components and Packaging Technology and Advanced Packaging, ASME Journal of Electronic Packaging. He is a Fellow of the American Society of Mechanical Engineers (FASME) and Fellow of Institution of Engineers Singapore (FIES).
Research Interests
His current research work includes Design-For-Reliability (DFR) assessments, Additive Manufacturing, Laser Metal Deposition Materials-Process-Performance (MPP) characterizations, Elastic-Plastic-Creep mechanics of lead-free (Sn-Ag-Cu) solders, Fitness-For-Service (FFS) assessments of welded joint and offshore structures. His research contributions to design-for-reliability (DFR) methodologies for lead-free solder has been documented in his book on Lead Free Solder : Mechanics and Reliability, Springer, 2012. (ISBN 978-4614-0462-0, e-ISBN 978-4614-0463-7). It covers lead-free solder mechanics, finite element modeling, simulations of failure for thermal cycling, cyclic bending, vibration fatigue and impact drop tests. He has research interest in Digital Image Correlation (AFM/DIC) analysis, Materials characterization, Nano-indentation, CNT applications.
Research Interests
His current research work includes Design-For-Reliability (DFR) assessments, Additive Manufacturing, Laser Metal Deposition Materials-Process-Performance (MPP) characterizations, Elastic-Plastic-Creep mechanics of lead-free (Sn-Ag-Cu) solders, Fitness-For-Service (FFS) assessments of welded joint and offshore structures. His research contributions to design-for-reliability (DFR) methodologies for lead-free solder has been documented in his book on Lead Free Solder : Mechanics and Reliability, Springer, 2012. (ISBN 978-4614-0462-0, e-ISBN 978-4614-0463-7). It covers lead-free solder mechanics, finite element modeling, simulations of failure for thermal cycling, cyclic bending, vibration fatigue and impact drop tests. He has research interest in Digital Image Correlation (AFM/DIC) analysis, Materials characterization, Nano-indentation, CNT applications.
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Lecture notes in mechanical engineeringpp.325-332, (2021)
FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURESno. 1 (2020): 119-136
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