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Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out/fan-in WLP, MEMS, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability.
Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. SMT, fan-out/fan-in WLP, MEMS, TSV, 3D IC Integration, heterogeneous integration and SiP. Leadfree soldering, manufacturing, and solder joint reliability.
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论文共 507 篇作者统计合作学者相似作者
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
JOURNAL OF ELECTRONIC PACKAGINGno. 1 (2024)
Chiplet Design and Heterogeneous Integration Packagingpp.101-136, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 1 (2023): 3-25
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Chiplet Design and Heterogeneous Integration Packagingpp.431-517, (2023)
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Chiplet Design and Heterogeneous Integration Packagingpp.271-380, (2023)
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IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 3 (2023): 399-425
John H. Lau, Gary Chen, C. C. Yang, Vincent Teng, Andy Peng, Joe Huang,Ning Liu,Y-H. Chen, Tzu-Ying Tseng,Ming Li
Journal of Electronic Packagingno. 2 (2023)
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Chiplet Design and Heterogeneous Integration Packagingpp.1-99, (2023)
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