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Jingru Dai received the B.S. degree in material science and engineering from Shandong University, Jinan, China, and the M.S. degree in material science and engineering from the Beijing University of Aeronautics and Astronautics, Beijing, China. She is currently pursuing the Ph.D. degree with the Department of Electrical and Electronic Engineering, University of Nottingham, Nottingham, U.K.
Her current research interests include silver sintering technology for die attachments, reliability tests, and failure analysis.
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Journal of Electronic Materialsno. 3 (2024): 1374-1398
2018 1st Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia)pp.23-33, (2018)
Jianfeng Li, Xi Lin,Jingru Dai,Bassem Mouawad,Christopher Mark Johnson,Hui Zhang, Xuejian Liu,Zhengren Huang
CIPS 2018; 10th International Conference on Integrated Power Electronics Systemspp.1-6, (2018)
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