Jindo Byun - Department of Medicine, Emory University School of Medicine

基本信息

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职业迁徙

个人简介

Jindo Byun (S'06) was born in Daegu, Korea, in 1981. He received the B.S. and M.S. degrees in electrical engineering from Ajou University, Suwon, Korea, in 2006 and 2008, respectively. He is currently working toward the Ph.D. degree in electrical engineering with Ajou University. His current research interests include substrate integrated waveguide (SIW) passive components design and signal integrity (SI), power integrity (PI) and electromagnetic compatibility (EMC) in mixed-signal systems.

研究兴趣

论文共 29 篇作者统计合作学者相似作者

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30.1 A 28gb/mm 2 4Xx-Layer 1tb 3b/cell WF-Bonding 3D-NAND Flash with 5.6gb/s/pin IOs

Sang-Soo Park, Jaedoeg Lyu, Myungjun Kim, Jaeyun Lee, Youngsun Song, Chungho Yu, Makoto Hirano, Yongseok Kwon, Jonghoon Park, Hojoon Kim, Daein Lee,Donghyun Seo, Byungrok Go, Seoyoon Jeon, Yoonjee Kim, Doo-Hyun Kim, Youngmin Jo,Hyun-Jun Yoon, Junehong Park, In-Mo Kim,Sunghoon Kim,Hokil Lee, Je-Hyeon Yu, Sanglok Kim, Hwan-Seok Ku,Jungmin Seo,Jindo Byun, Seunghyeon Yun, Kyoungtae Kang, Seung-Beom Kim, Yohan Lee, Yongkyu Lee, Kyung-Hwa Kang,Hanjun Lee, YoungHwan Ryu, Hyundo Kim, Wontae Kim, Hyeongdo Choi, Juho Jeon, Ansoo Park, Raehyun Song, Jae-Hwan Kim, Jungsoo Kim, Hwaseok Lee, Mookyung Lee, Jae-Ick Son,Jiho Cho, Moosung Kim, Jae-Woo Im,Jongmin Park, Hyuckjoon Kwon,Youngdon Choi,Chiweon Yoon, Seungjae Lee,Kiwhan Song,Sunghoi Hur

IEEE International Solid-State Circuits Conferencepp.1-3, (2025)

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30.1 A 28Gb/mm24xx-Layer 1tb 3b/cell WF-Bonding 3D-NAND Flash with 5.6gb/s/pin IOs

Sang-Soo Park, Jae-Doeg Lyu, Myungjun Kim, Jaeyun Lee, Younsun Song, Chung-Ho Yu, Hirano Makoto, Yongseok Kwon,Jong-Hoon Park, Ho-Joon Kim, Daein Lee,Donghyun Seo, Byungrok Go, Seoyoon Jeon, Yoonjee Kim, Doo-Hyun Kim, Youngmin Jo,Hyunjun Yoon, Junehong Park,Inmo Kim,Sunghoon Kim,Hokil Lee, Je-Hyeon Yu,Sang-Lok Kim, Hwan-Seok Ku,Jungmin Seo,Jindo Byun, Seung-Hyeon Yun,Kyoungtae Kang, Seung-Beom Kim, Yohan Lee, Yongkyu Lee, Kyunghwa Kang, Han-Jun Lee,Younghwan Ryu, Hyundo Kim, Wontae Kim, Hyeongdo Choi, Juho Jeon,Ansoo Park,Raehyun Song, Jae-Hwan Kim, Jung-Soo Kim, Hwa-Seok Lee, Moo-Kyung Lee,Jae-Ick Son,Jiho Cho,Moosung Kim,Jae-Woo Im,Jongmin Park, Hyuckjoon Kwon,Youngdon Choi,Chiweon Yoon, Seungjae Lee,Kiwhan Song, Sung-Hoi Hur

2025 IEEE International Solid-State Circuits Conference (ISSCC) (2025): 1-3

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A 40-Gb/s/pin Low-Voltage POD Single-Ended PAM-4 Transceiver with Timing Calibrated Reset-less Slicer and Bidirectional T-Coil for GDDR7 Application