基本信息
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Bio
Jie Geng (jgeng@indium.com) received his Ph.D. degree in metallurgy from the University of Surrey, United Kingdom. He is a research metallurgist in Indium Corporation’s research and development department, where he focuses on the development of novel lead-free, high-reliability solder alloys for automotive applications. He also investigates assembly process technologies in electronic packaging and interconnections. He continued as a materials scientist after graduation and has extensive experience on materials selection, design, processing, and characterization, especially on processing-structure-property relationships in various materials including ultrahigh-temperature alloys, lightweight alloys (aluminum and magnesium), magnetic materials, and ceramics. He is skilled in combinatorial and high-throughput material design using three-dimensional printing and computer programming with Python.
Research Interests
Papers共 33 篇Author StatisticsCo-AuthorSimilar Experts
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HongWen Zhang,Tyler Richmond, Kyle Aserian,Huaguang Wang,Jie Geng, Christopher Nash,Jonas Sjoberg, Claire Hotvedt
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.661-667, (2023)
IMAPSource Proceedingsno. Issue 1 (2023)
International Symposium on Microelectronicsno. 1 (2021): 000356-000361
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.643-653, (2021)
semanticscholar(2019)
Cited1Views0Bibtex
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International Symposium on Microelectronicsno. 1 (2018): 000198-000206
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Author Statistics
#Papers: 33
#Citation: 2124
H-Index: 22
G-Index: 29
Sociability: 4
Diversity: 2
Activity: 0
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