基本信息
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职业迁徙
个人简介
Jianfeng Zhu (Student Member, IEEE) was born in Changsha, China. He received the B.Eng. degree in communication engineering from the Beijing University of Posts and Telecommunications (BUPT), Beijing, China, in 2013. He is currently pursuing the joint Ph.D. degree with BUPT and the University of Technology Sydney (UTS), Ultimo, NSW, Australia.
From November 2015 to June 2018, he was a Research Assistant with the State Key Laboratory of Millimeter Waves, Department of Electronic Engineering, City University of Hong Kong, Hong Kong. From June to July 2019 and December 2019 to January 2020, he was a Visiting Student with the South China University of Technology (SCUT), Guangzhou, China, with the research of LTCC and antenna-in-package. He has authored and coauthored more than 40 journal and conference papers. His current research includes THz/SubTHz beam shaping and 3-D printing.
Mr. Zhu received the honorable mention from the 2019 IEEE International Conference on Microwave and Millimeter Wave Technology (ICMMT), Guangzhou. He was selected as a Finalist in the Student Paper Contest of 2018 Asia–Pacific Microwave Conference (APMC), Kyoto, Japan, and the 2019 IEEE International Wireless Symposium (IWS), Guangzhou.
研究兴趣
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IEEE Transactions on Vehicular Technologyno. 99 (2024): 1-10
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESno. 2 (2024): 1196-1205
IEEE Trans. Veh. Technol.no. 3 (2024): 4366-4382
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUESno. 99 (2024): 1-11
2023 IEEE International Symposium on Radio-Frequency Integration Technology (RFIT)pp.26-28, (2023)
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IEEE Transactions on Antennas and Propagationno. 7 (2023): 6185-6190
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IEEE Transactions on Antennas and Propagationno. 3 (2023): 2784-2789
2023 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting (USNC-URSI)pp.793-794, (2023)
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