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论文共 48 篇作者统计合作学者相似作者
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Byeongho Kim, Sanghoon Cha, Sangsoo Park,Jieun Lee, Sukhan Lee,Shin-haeng Kang, Jinin So, Kyungsoo Kim,Jin Jung,Jong-Geon Lee,Hyeonsu Kim,Jin-Seong Kim,
IEEE Microno. 99 (2024): 1-8
Jin Hyun Kim,Yuhwan Ro,Jinin So,Sukhan Lee,Shin-haeng Kang,YeonGon Cho,Hyeonsu Kim,Byeongho Kim,Kyungsoo Kim, Sangsoo Park,Jin-Seong Kim, Sanghoon Cha,
2023 IEEE Hot Chips 35 Symposium (HCS)pp.1-31, (2023)
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Kyungsan Kim, Hyunseok Kim,Jinin So, Wonjae Lee, Junhyuk Im, Sungjoo Park,Jeonghyeon Cho,Hoyoung Song
2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2023)
WonSuk Choi, SangKeun Kwak, Jaeseok Park, Jiyoung Do, Byeongseon Yun, Yoo-Jeong Kwon,Dongyeop Kim,Kyudong Lee,Tae Young Kim, Wonyoung Kim,Kyoungsun Kim,Sung Joo Park,
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
Ke Liu,Xuan Zhang,Jinin So,Jong-Geon Lee,Shinhaeng Kang,Sukhan Lee,Songyi Han,YeonGon Cho,Jin Hyun Kim, Yongsuk Kwon, KyungSoo Kim,Jin Jung,
Donghun Lee,Minseon Ahn,Jungmin Kim,Oliver Rebholz,Jinin So,Jong-Geon Lee,Jeonghyeon Cho,Vishnu Charan Thummala, J. V. Ravi Shankar, Sachin Suresh Upadhya, Mohammed Ibrahim Khan,Jin Hyun Kim
18TH INTERNATIONAL WORKSHOP ON DATA MANAGEMENT ON NEW HARDWARE, DAMON 2022pp.2:1-2:9, (2022)
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
Yun-Ho Lee,Dongyeop Kim, SangKeun Kwak, Jeonghun Baek,Kyoungsun Kim,Sung Joo Park,Jeonghyeon Cho,Hoyoung Song
2022 IEEE 31st Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)pp.1-3, (2022)
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