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论文共 32 篇作者统计合作学者相似作者
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2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2023)
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-8, (2023)
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MICROELECTRONICS RELIABILITY (2023): 114973-114973
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2022)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2022)
Maofen Zhang,Jens Heilmann, Yuen Sing Chan,Martin Richard Niessner, Paola Altieri-Weimar,Bernhard Wunderle
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)pp.522-527, (2022)
2022 IEEE 9TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, ESTCpp.480-483, (2022)
2021 27th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-6, (2021)
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