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During his tenure at Mentor and Siemens, he has built a strong international R&D organization (USA, Canada, Germany, India and Poland) with focus on innovative DFT technologies and collaboration with leading semiconductor companies. Under his leadership, the team has developed a number of revolutionary, industry-first, trend-setting Tessent® products: TestKompress® - the first commercial test compression product, TK/LBIST hybrid with VersaPoint™ and Observation Scan Technology which dramatically reduces test time, Defect-Oriented Test technology which provides unprecedented test quality in manufacturing as well as in-system test and Streaming Scan Network which reduces the design effort and test time for emerging computing architectures. The list of innovative products extends to Memory Test, Silicon Learning, and Mixed-Signal Test.
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论文共 371 篇作者统计合作学者相似作者
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IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.no. 2 (2024): 442-455
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsno. 11 (2023): 4260-4269
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2023 IEEE EUROPEAN TEST SYMPOSIUM, ETS (2023)
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ETSpp.1-6, (2023)
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IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.no. 9 (2023): 2815-2825
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Janusz Rajski,Vivek Chickermane, Jean-François Côté,Stephan Eggersglüß, Nilanjan Mukherjee,Jerzy Tyszer
IEEE Design & Testno. 99 (2023): 1-1
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