Jae-Woong Nah

Jae-Woong Nah (M'05) received the B.S. degree in metallurgical engineering from Korea University, Seoul, Korea, in 1997, the M.S. degree in metallurgical engineering from Seoul National University, Seoul, in 1999, and the Ph.D. degree in materials science and engineering from the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, in 2004. Following receipt of the Ph.D. degree, he joined the University of California, Los Angeles, as a Postdoctoral Research Associate. His research interests are flip-chip bumping process, electromigration in flip-chip solder joints, and reliability assessment of Cu/low-k interconnects. Dr. Nah is a Member of IMAPS.