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论文共 50 篇作者统计合作学者相似作者

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Optimizing the Vapor Chamber with Liquid Supply Layers for High Heat Flux Applications Using an ANN-based Multi-Objective Genetic Algorithm
Soosik Bang,Seungwoo Kim,Seokkan Ki,Junyong Seo,Jaechoon Kim,Bong Jae Lee,Youngsuk Nam
2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-6, (2024)
引用0浏览0EIWOS引用
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Thermal and Mechanical Simulations of 3D Packages with Custom High Bandwidth Memory (HBM)
Kamalika Chatterjee, Yan Li, Hochan Chang, Mohsen Damadam, Pouya Asrar,Jaechoon Kim, Glen Jeong, WooPoung Kim
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.1054-1059, (2024)
引用0浏览0EIWOS引用
0
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Enhancement of Thermal Transient Prediction Accuracy for Mobile AP Package
Hwanjoo Park,Taehwan Kim, Sunggu Kang,Jonggyu Lee, Sungho Mun,Jaechoon Kim,Hangi Jung,Dongwook Kim
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1339-1343, (2023)
引用0浏览0EIWOS引用
0
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Thermal Modeling and Analysis of High Bandwidth Memory in 2.5D Si-interposer Systems
Taehwan Kim,Jonggyu Lee,Jaechoon Kim,Eung-Chang Lee,Heejung Hwang,Youngdeuk Kim, Dan Kyung Suk Oh
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) (2022)
引用4浏览0EIWOS引用
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作者统计

#Papers: 50

#Citation: 629

H-Index: 19

G-Index: 24

Sociability: 5

Diversity: 2

Activity: 5

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